Bond Force Testers
Code: DTM-A Series
Suitable for testing the strength of microelectronic after bonding, and adhesion testing between solder and substrate surfaces, and failure analysis
Suitable for wire pull, bond shear, ball shear, die shear test
The corresponding test module can be replaced according to the need, and the system automatically identifies the module parameter information
With landing protection function to prevent damage to the test probe by misoperation
The equipment adopts air suspension bearings, which provide extremely low touchdown force and won't damage the substrate
| Code | Max. test force | Speed |
|---|---|---|
| DTM-A140 | 200kg | 0.1~200mm/min |
| DTM-A160 | 200kg | 0.1~500mm/min |
| DTM-A200 | 200kg | 0.1~500mm/min |
| DTM-A320 | 50kg | 0.1~1000mm/min |
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product specifications
